Thermal Expansion of Polymers

Control polymer thermal expansion from fundamental principles to reduction technologies Dimensional instability caused by thermal expansion remains a persistent challenge in polymer applications across automotive, packaging, and electronics industries. Thermal Expansion of Polymers: Fundamentals, Measurement, and Technologies provides a systematic treatment of the underlying mechanisms, measurement techniques, and advanced reduction methods. Written by Michio Ono, who brings more than 30 years of dedicated polymer research, this reference connects theory directly to implementable solutions. The book details both established and emerging measurement approaches, including positron annihilation lifetime spectroscopy and synchrotron radiation techniques for characterizing thermal expansion behavior. Coverage spans the molecular-level mechanisms driving expansion in polymers, standardized testing methods, and reduction technologies applicable to industrial processing. Practical examples illustrate how these methods address dimensional control problems in real manufacturing environments. Readers will also find: Fundamental principles governing thermal expansion behavior across different polymer types, including detailed treatment of polyolefin systems Emerging measurement technologies such as positron annihilation lifetime spectroscopy and synchrotron radiation applied to polymer characterization Reduction strategies for controlling dimensional change in automotive, packaging, and electronics polymer components Molecular-level explanations linking polymer structure and morphology to observed coefficients of thermal expansion Practical examples demonstrating direct industrial implementation of thermal expansion control methods in manufacturing processes Polymer chemists, chemical engineers, materials scientists, and process engineers working on dimensional stability challenges will find this reference directly applicable to their work. Research institutes focused on polymer characterization and thermal analysis will benefit from its systematic coverage of both established and emerging measurement and reduction methodologies.