Tallenna
The Bond Market in Hong Kong, China
This publication provides updates on recent developments in the bond market in Hong Kong, China and highlights developments connected to the bond market of the People’s Republic of China.
The report updates the earlier ASEAN+3 Bond Market Guide 2016: Hong Kong, China. It is part of the ASEAN+3 Bond Market Guide series, which provides information on the investment climate, rules, laws, opportunities, and characteristics of local bond markets in Asia and the Pacific.
The report updates the earlier ASEAN+3 Bond Market Guide 2016: Hong Kong, China. It is part of the ASEAN+3 Bond Market Guide series, which provides information on the investment climate, rules, laws, opportunities, and characteristics of local bond markets in Asia and the Pacific.
- Alaotsikko
- An ASEAN+3 Bond Market Guide Update
- ISBN
- 9789292623777
- Kieli
- englanti
- Paino
- 333 grammaa
- Julkaisupäivä
- 30.12.2020
- Kustantaja
- Asian Development Bank
- Sivumäärä
- 22
