Tallenna
Solder Paste in Electronics Packaging
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
- Alaotsikko
- Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
- Kirjailija
- Jennie S. Hwang
- Painos
- Softcover reprint of the original 1st ed. 1989
- ISBN
- 9789401160520
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 20.2.2012
- Kustantaja
- Springer
- Sivumäärä
- 456
