Tallenna
Solder Joint Technology
210,30 €
To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
- Alaotsikko
- Materials, Properties, and Reliability
- Kirjailija
- King-Ning Tu
- Painos
- Softcover reprint of hardcover 1st ed. 2007
- ISBN
- 9781441922847
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 19.11.2010
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 370
