Tallenna
Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
- Kirjailija
- Andrew E. Perkins, Suresh K. Sitaraman
- Painos
- 2009 ed.
- ISBN
- 9780387793931
- Kieli
- englanti
- Paino
- 446 grammaa
- Julkaisupäivä
- 23.10.2008
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 192
