Tallenna
Security and Privacy in Cyber-Physical Systems and Smart Vehicles
This book constitutes the refereed proceedings of the First EAI International Conference, SmartSP 2023, held in Chicago, USA, during October 12-13, 2023.
The 11 revised full papers were carefully reviewed and selected from 24 submissions.
- Alaotsikko
- First EAI International Conference, SmartSP 2023, Chicago, USA, October 12-13, 2023, Proceedings
- Toimittaja
- Yu Chen, Chung-Wei Lin, Bo Chen, Qi Zhu
- Painos
- 1st ed. 2024
- ISBN
- 9783031516290
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 5.2.2024
- Kustantaja
- Springer International Publishing AG
- Sivumäärä
- 172
