Tallenna
RF and Microwave Microelectronics Packaging II
nidottu, 2018
englanti
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
- Toimittaja
- Ken Kuang, Rick Sturdivant
- Painos
- Softcover reprint of the original 1st ed. 2017
- ISBN
- 9783319847191
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 9.6.2018
- Kustantaja
- Springer International Publishing AG
- Sivumäärä
- 172
