Tallenna
RF and Microwave Microelectronics Packaging
sidottu, 2009
englanti
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.
- Toimittaja
- Ken Kuang, Franklin Kim, Sean S. Cahill
- Painos
- 2010 ed.
- ISBN
- 9781441909831
- Kieli
- englanti
- Paino
- 446 grammaa
- Julkaisupäivä
- 17.11.2009
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 285
