Tallenna
Mechanics of Solder Alloy Interconnects
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
- Kirjailija
- Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau
- Painos
- 1994 ed.
- ISBN
- 9780442015053
- Kieli
- englanti
- Paino
- 446 grammaa
- Julkaisupäivä
- 31.1.1994
- Kustantaja
- Van Nostrand Reinhold Inc.,U.S.
- Sivumäärä
- 418
