Tallenna
Materials for Advanced Packaging
nidottu, 2018
englanti
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
- Painos
- Softcover reprint of the original 2nd ed. 2017
- ISBN
- 9783319832098
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 8.6.2018
- Kustantaja
- Springer International Publishing AG
- Sivumäärä
- 969
