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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.

Kirjailija
Qingke Zhang
Painos
Softcover reprint of the original 1st ed. 2016
ISBN
9783662517253
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
23.8.2016
Sivumäärä
143