
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
- Kirjailija
- Qingke Zhang
- Painos
- Softcover reprint of the original 1st ed. 2016
- ISBN
- 9783662517253
- Kieli
- englanti
- Paino
- 310 grammaa
- Sarja
- Springer Theses
- Julkaisupäivä
- 23.8.2016
- Sivumäärä
- 143