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Integrated Circuit Packaging, Assembly and Interconnections
Tallenna

Integrated Circuit Packaging, Assembly and Interconnections

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing.

Kirjailija
William Greig
Painos
Softcover reprint of hardcover 1st ed. 2007
ISBN
9781441939234
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
29.10.2010
Sivumäärä
300