Tallenna
IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
- Kirjailija
- Mustafa Celik, Larry Pileggi, Altan Odabasioglu
- Painos
- Softcover reprint of the original 1st ed. 2002
- ISBN
- 9781475776744
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 23.3.2013
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 310
