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Fundamentals of Lead-Free Solder Interconnect Technology
Tallenna

Fundamentals of Lead-Free Solder Interconnect Technology

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Alaotsikko
From Microstructures to Reliability
Painos
Softcover reprint of the original 1st ed. 2015
ISBN
9781489978011
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
1.10.2016
Sivumäärä
253