
Fundamentals of Lead-Free Solder Interconnect Technology
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
- Alaotsikko
- From Microstructures to Reliability
- Kirjailija
- Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
- Painos
- Softcover reprint of the original 1st ed. 2015
- ISBN
- 9781489978011
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 1.10.2016
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 253