Tallenna
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
- Toimittaja
- John W. Balde
- Painos
- Softcover reprint of the original 1st ed. 2003
- ISBN
- 9781461349778
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 23.2.2014
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 347
