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Failure Modes and Mechanisms in Electronic Packages
Tallenna

Failure Modes and Mechanisms in Electronic Packages

sidottu, 1997
englanti
With the proliferation of packaging technology, failure and reliability have become serious concerns. This reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies. The book should be of interest to electrical design engineers, materials and process engineers, reliability engineers and manufacturing engineers.
ISBN
9780412105913
Kieli
englanti
Paino
446 grammaa
Julkaisupäivä
30.11.1997
Sivumäärä
370