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Electronics Cooling: From the Chip to the Datacenter
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Electronics Cooling: From the Chip to the Datacenter

sidottu, 2026
englanti
A concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling, scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.
ISBN
9780443470844
Kieli
englanti
Paino
446 grammaa
Julkaisupäivä
1.11.2026
Sivumäärä
300