Tallenna
Electronic Packaging for High Reliability, Low Cost Electronics
The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability.
- Toimittaja
- R.R. Tummala, Marija Kosec, W.K. Jones, Darko Belavic
- Painos
- 1st ed. Softcover of orig. ed. 1998
- ISBN
- 9789048150854
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 3.12.2010
- Kustantaja
- Springer
- Sivumäärä
- 296
