Siirry suoraan sisältöön
Electrical Design of Through Silicon Via
Tallenna

Electrical Design of Through Silicon Via

This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
Painos
Softcover reprint of the original 1st ed. 2014
ISBN
9789401779494
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
27.9.2016
Kustantaja
Springer
Sivumäärä
280