
Electrical Conductive Adhesives with Nanotechnologies
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives).
- Kirjailija
- Yi (Grace) Li, Daniel Lu, C.P. Wong
- Painos
- 2010 ed.
- ISBN
- 9780387887821
- Kieli
- englanti
- Paino
- 446 grammaa
- Julkaisupäivä
- 16.10.2009
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 437