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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Tallenna

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.
Kirjailija
Sung Kyu Lim
Painos
2013 ed.
ISBN
9781489986962
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
16.12.2014
Sivumäärä
560