Tallenna
Copper Wire Bonding
Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.
- Kirjailija
- Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G Pecht
- Painos
- Softcover reprint of the original 1st ed. 2014
- ISBN
- 9781493953493
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 23.8.2016
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 235
