Tallenna
Copper Electrodeposition for Nanofabrication of Electronics Devices
In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes.
- Toimittaja
- Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi
- Painos
- Softcover reprint of the original 1st ed. 2014
- ISBN
- 9781493953738
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 23.8.2016
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 282
