Tallenna
Bonding in Microsystem Technology
Kirjailija:
nidottu, 2010
englanti
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
- Kirjailija
- Jan A. Dziuban
- Painos
- Softcover reprint of hardcover 1st ed. 2006
- ISBN
- 9789048171514
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 25.11.2010
- Kustantaja
- Springer
- Sivumäärä
- 334
