Tallenna
Area Array Interconnection Handbook
muu, 2012
englanti
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer.
- Toimittaja
- Karl J. Puttlitz, Paul A. Totta
- Painos
- Softcover reprint of the original 1st ed. 2001
- ISBN
- 9781461355298
- Kieli
- englanti
- Paino
- 249 grammaa
- Julkaisupäivä
- 12.11.2012
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 1188
