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Advances in Thermal Modelling of Electronic Components and Systems v. 3
Tallenna

Advances in Thermal Modelling of Electronic Components and Systems v. 3

This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov
ISBN
9780791800652
Kieli
englanti
Paino
794 grammaa
Julkaisupäivä
1.1.1998