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Advances in Electronic Circuit Packaging
Tallenna

Advances in Electronic Circuit Packaging

Alaotsikko
Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Painos
Softcover reprint of the original 1st ed. 1962
ISBN
9781489972972
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
1.1.1962
Sivumäärä
328