Siirry suoraan sisältöön
Advances in Electronic Circuit Packaging
Tallenna

Advances in Electronic Circuit Packaging

Alaotsikko
Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964
Painos
Softcover reprint of the original 1st ed. 1965
ISBN
9781489972958
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
1.1.1965
Sivumäärä
297