
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
- Toimittaja
- Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
- Painos
- Softcover reprint of the original 1st ed. 2013
- ISBN
- 9781489979339
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 23.8.2016
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 560