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Advanced Flip Chip Packaging
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Advanced Flip Chip Packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.

Painos
Softcover reprint of the original 1st ed. 2013
ISBN
9781489979339
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
23.8.2016
Sivumäärä
560