Tallenna
3D Stacked Chips
nidottu, 2018
englanti
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
- Alaotsikko
- From Emerging Processes to Heterogeneous Systems
- Toimittaja
- Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
- Painos
- Softcover reprint of the original 1st ed. 2016
- ISBN
- 9783319793054
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 26.5.2018
- Kustantaja
- Springer International Publishing AG
- Sivumäärä
- 339
