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3D Interconnect Architectures for Heterogeneous Technologies
Tallenna

3D Interconnect Architectures for Heterogeneous Technologies

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Alaotsikko
Modeling and Optimization
Painos
2022 ed.
ISBN
9783030982287
Kieli
englanti
Paino
446 grammaa
Julkaisupäivä
28.6.2022
Sivumäärä
395