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Thermal Stress and Strain in Microelectronics Packaging
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Thermal Stress and Strain in Microelectronics Packaging

Engelska
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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.
Redaktör
John Lau
Upplaga
Softcover reprint of the original 1st ed. 1993
ISBN
9781468477696
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2012-04-30
Sidor
884