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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Författare:
Engelska
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One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.
Författare
Gerard Kelly
Upplaga
Softcover reprint of the original 1st ed. 1999
ISBN
9781461372769
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2012-10-08
Sidor
134