Lead-free Solders
- Phase diagrams and alloy development
- Effect of minor alloying additions
- Composite approaches including nanoscale reinforcements
- Mechanical issues affecting reliability
- Reliability under impact loading
- Thermomechanical fatigue
- Chemical issues affecting reliability
- Whisker growth
- Electromigration
- Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
- Redaktör
- K. Subramanian
- ISBN
- 9781119966210
- Språk
- engelska
- Utgivningsdatum
- 2012-03-06
- Förlag
- Wiley

