
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
- Författare
- Qingke Zhang
- Upplaga
- Softcover reprint of the original 1st ed. 2016
- ISBN
- 9783662517253
- Språk
- Engelska
- Vikt
- 310 gram
- Serie
- Springer Theses
- Utgivningsdatum
- 2016-08-23
- Sidor
- 143
