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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis.
Upplaga
Softcover reprint of the original 1st ed. 2003
ISBN
9781461349891
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2012-10-14
Sidor
185