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Electrical Design of Through Silicon Via
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Electrical Design of Through Silicon Via

Engelska
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This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
Upplaga
Softcover reprint of the original 1st ed. 2014
ISBN
9789401779494
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2016-09-27
Förlag
Springer
Sidor
280