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Designing TSVs for 3D Integrated Circuits
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Designing TSVs for 3D Integrated Circuits

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The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs.
ISBN
9781461455073
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2012-09-23
Sidor
76