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3D Microelectronic Packaging
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3D Microelectronic Packaging

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

Undertitel
From Architectures to Applications
Upplaga
Second Edition 2021
ISBN
9789811570926
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2021-11-24
Sidor
622