
3D Microelectronic Packaging
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
- Undertitel
- From Architectures to Applications
- Redaktör
- Yan Li, Deepak Goyal
- Upplaga
- Second Edition 2021
- ISBN
- 9789811570926
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2021-11-24
- Sidor
- 622