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3D Microelectronic Packaging

231,60 €

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

Undertitel
From Fundamentals to Applications
ISBN
9783319830865
Språk
engelska
Vikt
281 gram
Utgivningsdatum
13.7.2018
Sidor
463