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3D Microelectronic Packaging

231,60 €

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

Undertitel
From Architectures to Applications
Upplaga
2
ISBN
9789811570896
Språk
engelska
Vikt
518 gram
Utgivningsdatum
24.11.2020
Sidor
622