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Solder Joint Technology
To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
- Undertitel
- Materials, Properties, and Reliability
- Författare
- King-Ning Tu
- Upplaga
- Softcover reprint of hardcover 1st ed. 2007
- ISBN
- 9781441922847
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2010-11-19
- Sidor
- 370
