Spara
Multichip Modules with Integrated Sensors
Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.
- Redaktör
- W.K. Jones, Gábor Harsányi
- Upplaga
- Softcover reprint of the original 1st ed. 1996
- ISBN
- 9789401066310
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2011-10-06
- Förlag
- Springer
- Sidor
- 336
