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Integrated Circuit Packaging, Assembly and Interconnections
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Integrated Circuit Packaging, Assembly and Interconnections

Författare:
Engelska
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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing.

Författare
William Greig
Upplaga
Softcover reprint of hardcover 1st ed. 2007
ISBN
9781441939234
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2010-10-29
Sidor
300