
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
- Redaktör
- Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
- Upplaga
- Softcover reprint of the original 1st ed. 2013
- ISBN
- 9781489979339
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2016-08-23
- Sidor
- 560
