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Materials for Advanced Packaging
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Materials for Advanced Packaging

inbunden, 2016
Engelska
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
Upplaga
2nd ed. 2017
ISBN
9783319450971
Språk
Engelska
Vikt
446 gram
Utgivningsdatum
2016-12-30
Sidor
969