Hakutulokset: Kirjoja kirjailijalta C.P. Wong
yhteensä 17 hakutulosta
Electronics Manufacturing
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Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as …
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, …
Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as …
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, …
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip …
Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as …
Electrical Conductive Adhesives with Nanotechnologies
"e;Electrical Conductive Adhesives with Nanotechnologies"e; begins with an overview of electronic packaging and discusses the various adhesives options currently available, …
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, …
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip …
Innovations in Diagnostic Radiology
This volume of the new series, "Medical Radiology" addresses the important topic of "Innovations in Diagnostic Radiology". It presents examples of current work of interest not only …
Nano-Bio- Electronic, Photonic and MEMS Packaging
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to …