Spara
Solder Paste in Electronics Packaging
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
- Undertitel
- Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
- Författare
- Jennie S. Hwang
- Upplaga
- Softcover reprint of the original 1st ed. 1989
- ISBN
- 9789401160520
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2012-02-20
- Förlag
- Springer
- Sidor
- 456
