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Microelectronics Packaging Handbook

207,80 €

This text is the third of three volumes to update the author's earlier one-volume "Microelectronics Handbook", first published in 1988. Revised to incorporate advances in the industry, this volume provides a balance of theory and practical applications. It explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.

Undertitel
Subsystem Packaging Part III
Upplaga
2
ISBN
9780412084515
Språk
engelska
Vikt
518 gram
Utgivningsdatum
31.1.1997
Sidor
628