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IC Interconnect Analysis
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IC Interconnect Analysis

As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
Upplaga
Softcover reprint of the original 1st ed. 2002
ISBN
9781475776744
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
23.3.2013
Sidor
310